http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006257294-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f9af914ed2fb00cd4f1b8b1a28964e4 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2005-03-17^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19834520e335fe7396702e2626eaed64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb3b77a4ca0dcf6464a964fc809ad66f |
| publicationDate | 2006-09-28^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006257294-A |
| titleOfInvention | Resin composition, method for producing the same, and molded article |
| abstract | PROBLEM TO BE SOLVED: To provide a resin composition capable of forming a cured product having excellent various physical properties such as insulation, thermal shock resistance, moldability, strength, etc. and exhibiting a high appearance, a method for producing the same, and the resin composition A molded body is provided. SOLUTION: A resin composition comprising three components of a phenol compound, a compound containing at least one glycidyl group and / or an epoxy group, and inorganic fine particles, wherein the resin composition has a Tg or less in the cured product. It is a resin composition in which the ratio (α 2 / α 1 ) between the thermal expansion coefficient α 1 and the thermal expansion coefficient α 2 of Tg or more is 2.0 or less. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101125533-B1 |
| priorityDate | 2005-03-17^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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