http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006311230-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b4560b8ce75fb9ce01a2be76af24f29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-332 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-09 |
| filingDate | 2005-04-28^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebc70ea12cff3787c7cb6852a85914f3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3350a95167a6a7764a339572606d718a |
| publicationDate | 2006-11-09^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006311230-A |
| titleOfInvention | Method for manufacturing a lame mode crystal resonator |
| abstract | PROBLEM TO BE SOLVED: To obtain a processing method of a vibrating part for satisfying a reduction in size and a low CI value, particularly to a resonator shape of a lame mode crystal resonator. In order to solve the problem, the present invention uses the four corners of the piezoelectric element plate as nodes when a charge is applied to the rectangular piezoelectric element plate using an LQ2T cut quartz substrate. In a manufacturing method of a lame mode quartz crystal resonator that generates a vibration form of a contour vibration that expands and contracts in the lateral direction when extending in the longitudinal direction of the rectangular shape and expands and contracts in the longitudinal direction when extending in the rectangular lateral direction. The step of applying a protective film to the entire rectangular piezoelectric element plate, the step of obtaining the vibration part, the support part, and the connection part, and the step of further reducing the plate thickness of the vibration part are performed by wet etching. The etching solution used in the wet etching process described above is acidic ammonium fluoride (NH 4 F · HF) 55% to 75%, hydrofluoric acid (HF) 45% to 25%, and temperature conditions 70 ° C. to 95 ° C. Process below. [Selection] Figure 5 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014110490-A |
| priorityDate | 2005-04-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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