http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006507518-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-422 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F- http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D1-00 |
| filingDate | 2003-09-18^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-03-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006507518-A |
| titleOfInvention | Method for removing image-forming layer from semiconductor substrate stack |
| abstract | It provides a solution to errors made during the lithographic process in a multilayer imaging system, such as inaccurate film thickness, undesirable coating quality, and inaccurate feature dimensions. To optimize manufacturing efficiency, it is desirable to be able to remove the lower layer (undercoat or lower layer), recoat and usually remove the upper layer (image forming layer) without curing. Such a method is a reprocessing method for removing the image forming layer from the substrate stack. The stack consists of a substrate, a lower layer adjacent to the substrate and an imaging layer containing silicon adjacent to the lower layer. The method comprises: (a) contacting the substrate stack with an imaging layer removal solvent; (b) removing the imaging layer using the imaging layer removal solvent, thereby forming a substrate / underlayer stack, wherein the image Solvents for forming layer removal are glycol ether, ketone, ester, lactate, dimethyl sulfoxide (DMSO), dimethylformamide (DMF), tetrahydrofuran (THF), methyltetrahydrofuran, dioxane, tetrahydropyran, ethyltetrahydropyran-4-acetate, methyltetrahydro Selected from the group consisting of pyran-4-methanol, tetrahydropyran-4-one, n-butyl acetate, n-amyl acetate and any combination thereof; and (c) imaging after removal of the imaging layer Remove layer removal solvent from substrate / underlayer stack : Comprising the step. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007140252-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007280982-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4597844-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101500775-B1 |
| priorityDate | 2002-09-19^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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