http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007002268-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D15-02
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filingDate 2005-06-21^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fd822ff4c783b9920d8e8d39969460b
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publicationDate 2007-01-11^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007002268-A
titleOfInvention Surface treatment method for polishing member and article thereof
abstract 【Task】 The present invention is an ultra-smooth surface of a semiconductor LSI device surface, and polishing equipment used for precision finishing processing for processing them, in particular, wear resistance and corrosion resistance of a polishing member for ultra-smoothing each part, Provided to improve performance such as anti-contamination performance, applying high-frequency pulse voltage to the polishing member under reduced pressure, and applying high-grade carbon / silicon ion implantation and a gradient structure. An article coated with a carbon film is provided. [Solution] Using a plasma-based ion implantation / film formation method, a hydrocarbon-based / silicon-based mixed gas containing at least one atom of carbon and silicon is introduced in vacuum to two or more different materials. Provided are a polishing member and a surface treatment method for forming a high-quality carbon film having a carbon + silicon ion implantation and an inclined structure by generating a plasma and applying a negative high-frequency pulse voltage. [Selection] Figure 1
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