http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007078820-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2005-09-12^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3138fde95eafe03cf6c9a8cf3984f15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75b960309455861d73313480b56e91d6 |
| publicationDate | 2007-03-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007078820-A |
| titleOfInvention | Photosensitive resin composition, semiconductor device and display element using the same |
| abstract | 【Task】 Conventional resins contain amide bonds, aromatic rings, etc., so they absorb a lot of ultraviolet rays such as g-line and i-line, and the photoacid generator cannot use light sufficiently, resulting in low sensitivity. There was a problem. On the other hand, in order to increase the sensitivity, for example, when the molecular weight of the resin is lowered, there is a problem that the residual film ratio is low because the resin pattern to be retained dissolves more than necessary and undissolved (scum) is generated. there were. Furthermore, the surface protective film and interlayer insulating film of semiconductor elements in recent years tend to be thicker, and there has been a demand for a photosensitive resin composition that achieves both higher sensitivity, a higher residual film ratio, and no dissolution residue. . [Solution] (A) a cyclic olefin-based resin having an acidic group, (B) a photoacid generator, (C) a compound having a reactive group capable of binding to the acidic group of (A) at a temperature of 130 ° C. or higher, and (D ) A photosensitive resin composition comprising a phenolic compound. [Selection] Figure 4 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013130816-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014224255-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016139030-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10025182-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015141717-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014225662-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015141717-A1 |
| priorityDate | 2005-09-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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