http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007131829-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40 |
| filingDate | 2006-05-22^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9730310dc102bb568ea37cfc2321ecba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_182751a3d77ba8709910fce8dd53f95e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb1bb37d261bd9d78ef16b7468475672 |
| publicationDate | 2007-05-31^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007131829-A |
| titleOfInvention | Epoxy resin composition and insulated electrical and electronic parts |
| abstract | A high Tg epoxy resin composition having excellent crack resistance and insulating properties, stability, and heat resistance, and an electrical / electronic component insulated using the epoxy resin composition are provided. An epoxy resin composition according to the present invention contains (a) an epoxy resin, (b) an acid anhydride, (c) fused silica, (d) a basic pH adjuster, and (e) a curing accelerator. Thus, the epoxy resin composition can be used for insulation treatment to produce an electric / electronic component. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009289443-A |
| priorityDate | 2005-10-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Showing number of triples: 1 to 72 of 72.