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filingDate 2006-01-06^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-07-19^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007184381-A
titleOfInvention Flip-chip mounting circuit board and manufacturing method thereof, and semiconductor device and manufacturing method thereof
abstract A circuit board for flip chip mounting capable of ensuring connection reliability between a semiconductor element and a circuit board is provided. In a circuit board for flip chip mounting comprising a wiring pattern on a substrate surface, a connection pad for flip chip mounting, and a solder resist having an opening formed on the connection pad. A conductive material 5 is formed in the portion 4. [Selection] Figure 1
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