http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008038260-A

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Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d370be3f56be44c99a76e6b3ab19c9c3
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D01F6-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D01F8-12
filingDate 2006-08-01^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86410e587dcdc908c01cdb0413116a31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cc9f95431e05600a9ba7139174e048a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d921b4a6629cee7cc826feb9b1f90684
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publicationDate 2008-02-21^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008038260-A
titleOfInvention Polyamide fiber for thermal bonding
abstract An object of the present invention is to melt and function as an adhesive by heat treatment at low temperature, and can be used when bonding materials such as various fiber materials and films, and the bonded materials are difficult to peel off and have high adhesive strength A polyamide fiber for heat bonding processing is provided. Nylon 6, nylon 11 and nylon 12 components are essential copolymerization components, and one component selected from nylon 66, nylon 69, nylon 610, nylon 612 and nylon 613 components is a copolymerization component. Polyamide fiber composed of a single yarn comprising a copolymerized polyamide (polyamide A) as a constituent component, and the polyamide A is present on the fiber surface in a cross section cut perpendicular to the longitudinal direction of the single yarn A polyamide fiber for heat-bonding processing. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2338928-A1
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priorityDate 2006-08-01^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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