http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008047604-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62
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filingDate 2006-08-11^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a870dd0a25df541470060ac0b98a340
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publicationDate 2008-02-28^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008047604-A
titleOfInvention Metallized substrate, semiconductor device
abstract Light emitted from a semiconductor light emitting device can be efficiently emitted to the outside to increase the light emission efficiency, and the thickness of the solder layer can be maintained when the semiconductor light emitting device is joined. Provided is a metallized substrate that can improve the adhesion to the electrode, improve the bonding strength of the semiconductor element, and can keep the resistance between the element terminal and the substrate electrode small. A ceramic substrate, a first active metal layer formed on the ceramic substrate, an aluminum electrode formed on the first active metal layer, a barrier layer formed on at least a part of the surface of the aluminum electrode, A metallized substrate comprising a solder layer formed on the barrier layer. [Selection] Figure 1
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priorityDate 2006-08-11^^<http://www.w3.org/2001/XMLSchema#date>
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