http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008143036-A

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filingDate 2006-12-11^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef6cc175719b1bd9a1ac3bb9ed9c9e73
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publicationDate 2008-06-26^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008143036-A
titleOfInvention Copper plate
abstract The present invention provides a copper-clad board suitable for flexible printed wiring boards, having a small dimensional change rate after etching, characteristics suitable for AOI, excellent slipperiness and adhesiveness. A polyimide film formed from paraphenylenediamine and 4,4′-diaminodiphenyl ether as a diamine component and pyromellitic dianhydride as an acid dianhydride component, having a particle size of 0.01 to 1. An inorganic particle having a particle size distribution of 5 μm and an average particle diameter of 0.05 to 0.7 μm and inorganic particles having a particle diameter of 0.15 to 0.60 μm account for 80% by volume or more of all particles. A copper-clad plate obtained by adhering a copper plate via an adhesive to one or both sides of a film dispersed in the film at a ratio of 0.1 to 0.9% by weight per resin weight. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114603944-A
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type http://data.epo.org/linked-data/def/patent/Publication

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