http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008174640-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-30 |
| filingDate | 2007-01-18^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05e71c093fd0d37058d0d932b7983756 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55af40bbdfdcb5d1d314142ddf330765 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcbc7f680b12254396365ccef3d30951 |
| publicationDate | 2008-07-31^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008174640-A |
| titleOfInvention | Thermosetting composition for optical semiconductor, die bond material for optical semiconductor element, underfill material for optical semiconductor element, sealing agent for optical semiconductor element, and optical semiconductor element |
| abstract | When used as a sealant for sealing a light-emitting element of an optical semiconductor element such as a light-emitting diode, the adhesion to a housing material or the like enclosing the light-emitting element, and light having a short wavelength A thermosetting composition for optical semiconductors that does not cause discoloration due to heat generation of a light emitting device sealed in a cured product is provided. A thermosetting composition for an optical semiconductor comprising a silicone resin having at least one cyclic ether-containing group in a molecule, a liquid acid anhydride, and a curing accelerator, the liquid acid anhydride and the curing A mixture of the liquid acid anhydride and the curing accelerator, each of which has a pseudo-absorption coefficient represented by a specific formula at a wavelength of 400 nm in tetrahydrofuran (THF) at 25 ° C. The thermosetting composition for optical semiconductors having a pseudo-absorption coefficient of 0.2 to 10 at 25 ° C. and a wavelength of 400 nm. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-214906-U1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013508532-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009108109-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014037528-A |
| priorityDate | 2007-01-18^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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