| abstract |
Provided is a highly reliable stacked semiconductor package in which functional elements are three-dimensionally arranged using existing infrastructure and at low cost. In a stacked semiconductor package in which a plurality of semiconductor chips 10 and an interposer 6 are stacked, the interposer 6 has a silicon substrate having a through electrode and a glass transition temperature of 300 ° C. or higher, a tensile elastic modulus of 5 to 20 GPa, and a linear expansion. A laminate with a printed wiring board in which a wiring layer made of a conductive material is formed on a polymer film having a coefficient of −3 to +8 ppm / ° C. and a thickness of 2.5 to 40 μm is used. [Selection] Figure 3 |