| abstract |
A high power LED package and a manufacturing method thereof are provided. The present invention includes the steps of forming at least one chip mounting portion and at least one through groove in a metal plate, and forming an insulating layer having a constant thickness on the entire outer surface of the metal plate; Forming an electrode part electrically connected to the light emitting chip mounted on the chip mounting part; and cutting the metal plate along a cutting line to separate the package. According to the present invention, it is possible to prevent thermal shock due to different thermal expansion coefficients between components, ensure stable heat dissipation characteristics in a high temperature environment, minimize optical loss and improve optical characteristics, In addition, the assembly process can be simplified to enable mass production, and the manufacturing cost can be reduced. [Selection] Figure 9 |