| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c9f07df054c2af9e4827dc7fc8013d91 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-261
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3218 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-26 |
| filingDate |
2009-05-26^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ca73a2b3de1408020143a30cb5f9fac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_859a780dd3b286adb5a8a810d7c59d2e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1994f2836b010d411fe0556909b9f9fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da37627d07798b584178474ecffd4d96 |
| publicationDate |
2009-08-27^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009190089-A |
| titleOfInvention |
Cleaning agent for removing solder flux and solder flux cleaning method |
| abstract |
[PROBLEMS] To provide an excellent cleaning property even when cleaning a lead-free solder flux, a high-melting-point solder flux, and the like, and also exhibit excellent rinsing characteristics in rinsing using an alcohol solvent in the next process. Provided are a solder flux removing cleaning agent and a solder flux cleaning method. SOLUTION: When the content of glycol compound is less than 1% by weight relative to the total amount, the content of benzyl alcohol is 70-99.9% by weight, and the content of amino alcohol is 0.1%. A cleaning agent for removing solder flux of ˜30% by weight is constituted and used for cleaning lead-free solder flux, high melting point solder flux and the like. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014104218-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014130956-A |
| priorityDate |
2003-08-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |