http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009206314-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bc9976a81442c6b94ccab8ba654cc28 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2008-02-28^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc9b1caf01b37b10b8f0f5b0049cf5e2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b19d0fc6373161fcf5286f2c581bb3a4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad22ecf667e0bac9d3df8bb1a0d4d440 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0b6dd8c9498b9192f618203907d6ff0 |
| publicationDate | 2009-09-10^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009206314-A |
| titleOfInvention | Single-sided resin-encapsulated semiconductor device |
| abstract | The present invention provides a single-side resin-encapsulated semiconductor device that is extremely stable with little warpage in all processes from room temperature to solder reflow, and has excellent mountability and reliability after mounting. In a semiconductor device in which a semiconductor element is mounted on one surface of a substrate and only one surface on the substrate surface side on which the semiconductor element is mounted is sealed with a resin composition, the resin composition is a cured product thereof. Glass transition temperature Tg (° C.), thermal expansion coefficient α1 (ppm / ° C.) of Tg or less, thermal expansion coefficient α2 (ppm / ° C.) of Tg or more, and thickness t (μm) of the sealing material part as manufacturing conditions , Normal temperature Troom (° C.), and reflow temperature Treflow (° C.): , 200 <t <800)... A single-side resin-encapsulated semiconductor device using a resin composition that satisfies the relationship represented by (1). [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014063888-A |
| priorityDate | 2008-02-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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