http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009246376-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L65-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L45-00 |
| filingDate | 2009-06-16^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75b960309455861d73313480b56e91d6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf2ce698300ab33b54df4ed3ec481138 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3138fde95eafe03cf6c9a8cf3984f15 |
| publicationDate | 2009-10-22^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009246376-A |
| titleOfInvention | Semiconductor device and resin composition |
| abstract | [PROBLEMS] To provide a photosensitive resin composition excellent in low stress, solvent resistance, low water absorption, electrical characteristics, and the like, and a connecting terminal excellent in high positional accuracy, size and height uniformity using the same. Provided is a semiconductor device for a wafer level chip size package. The semiconductor device includes a chip on which a semiconductor circuit is formed, a device terminal provided on a surface of the chip on the semiconductor circuit formation side, and an external circuit board bonding terminal that is electrically coupled to the device terminal. In a wafer level chip size semiconductor device, a terminal for joining an external circuit board is composed of a protrusion 7 made of an insulator and a metal layer 9 provided on the surface of the insulator, and the insulator has a cyclic olefin resin (A ), A photoacid generator (B), and a resin composition comprising a compound (C) having a reactive group capable of binding to the acidic group of (A) at a temperature of 130 ° C. or higher. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017178790-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10074473-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10847303-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018350508-A1 |
| priorityDate | 2009-06-16^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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