| abstract |
In a resin composition containing an epoxy resin and an inorganic filler, a resin composition having lower viscosity and fluidity than before, a liquid resin composition for semiconductor encapsulation, a liquid resin composition for underfill, and a semiconductor device To provide. A surfactant containing an epoxy resin, a curing agent, an inorganic filler, and polyoxyethylene in the structure is an essential component, and the surfactant containing polyoxyethylene in the structure is represented by the following general formula (1). It is a resin composition characterized by these. [Chemical 1] (In the formula, R 1 is C m H 2m + 1 −0, m is an integer of 1 to 30, n is an integer of 1 to 60, and R 2 represents H.) [Selection figure] None |