| abstract |
The present invention provides a method for bonding a conductive wire to a metallic glass, which can stably bond the conductive wire to a metallic glass layer. In joining a conducting wire 2 to a metallic glass substrate 1 which is a metallic glass layer, the conducting wire 2 is pressed against a joining surface 1a of the metallic glass substrate 1, and ultrasonic energy is applied to the conducting wire 2 from an ultrasonic tool 3. Thereby, the metallic glass substrate 1 and the conducting wire 2 are joined. When an Al-based bonding wire is used as the conducting wire 2, a wedge tool is used as the ultrasonic tool 3. [Selection] Figure 1 |