| abstract |
An improved composition and method for removing at least one material from a microelectronic device structure for regeneration, rework, recycling, and / or reuse of the microelectronic device structure. . A removal composition and method for removing a layer from a rejected microelectronic device structure having at least one material layer thereon. The removal composition includes hydrofluoric acid. The composition achieves substantial removal of the material (s) to be removed without damaging the retained layer for regeneration, rework, recycling, and / or reuse of the structure. [Selection] Figure 1A |