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filingDate 2009-12-24^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2011-07-07^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011131456-A
titleOfInvention Gas barrier polyimide film and metal laminate using the same
abstract [PROBLEMS] To prevent oxygen and water vapor from passing through with high dimensional stability, so that the decrease in peel strength between a polyimide film and a metal layer is small even at high temperatures, and it is suitable for a substrate for fine pitch circuits requiring high dimensional accuracy. A gas barrier polyimide film and a metal laminate using the polyimide film are provided. An SiO 2 layer is formed on one side of a polyimide film having an elastic modulus of 4 GPa or more, a linear expansion coefficient of 50 to 200 ° C. of 0 to 22 ppm / ° C., and a heat shrinkage of 200% at 200 ° C. for 1 hour or less. Is a gas barrier polyimide film having an oxygen permeability of 5.0 × 10 −15 mol / m 2 · s · Pa or less. [Selection figure] None
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