http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011244021-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2011-09-09^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48dd2fac4f2d33adbb131ddb8d71b3e2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58617531664ab6b2420cc6fdc78653c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ff15cc3e3a1492e1145757353e5db00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32477aa4f5a41021f98fa0f681040e34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2e575dee18e4218935f1a3da622c374 |
| publicationDate | 2011-12-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011244021-A |
| titleOfInvention | Semiconductor device and manufacturing method thereof, and substrate for semiconductor device and manufacturing method thereof |
| abstract | A semiconductor device and a method for manufacturing the same, and a substrate for a semiconductor device and a method for manufacturing the same are provided. A semiconductor device 10 is electrically connected by a plurality of terminal portions 13 each having a protruding portion 13c, a die pad 12 having a protruding portion 12c, an internal terminal surface 13b of each terminal portion 13 and a connecting portion 17. The semiconductor element 15 is provided. The sealing resin part 11 seals the die pad 12, the terminal part 13, the semiconductor element 15, and the connection part 17. On the other hand, the external terminal surface 13a of each terminal portion 13 and the outer surface 12a of the die pad 12 are arranged on the same plane. Further, a permanent resist layer 18 is formed between a portion below the projecting portion 12c of the die pad 12 and a portion below the projecting portion 13c of the terminal portion 13 and a portion below the projecting portion 13c of the adjacent terminal portion 13. Yes. [Selection] Figure 1 |
| priorityDate | 2011-09-09^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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