| abstract |
The present invention provides a laminated body and a laminated circuit board for device creation that can be precisely positioned, can be peeled smoothly after production, and do not peel in the production process. Linear expansion of 100 ° C. to 200 ° C. obtained by reaction of one surface of a kind of inorganic layer selected from a glass plate, a ceramic plate, a silicon wafer, and a metal, and an aromatic tetracarboxylic acid and an aromatic diamine. A polyimide film having a coefficient of 4 ppm / ° C. to +4 ppm / ° C. (both in the film length direction and width direction) and bonded together without an adhesive layer. A laminated body and a laminated circuit board in which the bonded surface is a surface roughness and a PV value of 15 nm or less. [Selection figure] None |