| abstract |
The present invention comprises an abrasive, an aqueous carrier, (c) an oxidant having a standard reduction potential greater than 0.7V and less than 1.3V relative to a standard hydrogen electrode, and optionally a borate anion source (provided that the oxidant The chemical mechanical polishing composition comprises a borate anion source when the non-perborate peroxide, perphosphate, or percarbonate is present. A polishing composition is provided. The present invention also provides a method of polishing a substrate using the chemical mechanical polishing composition described above. |