http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012038710-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a07d0b3e3169dd026ecd9113fc9cc4ad
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-02
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-02
filingDate 2011-06-13^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adeb219917d3ddd341712c6f3600c7f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d9504b4f9e0b1406c9457c199eb84aa
publicationDate 2012-02-23^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012038710-A
titleOfInvention Flexible flat cable, flexible printed circuit board, flexible flat cable manufacturing method, and flexible printed circuit board manufacturing method
abstract A flexible flat cable, a flexible printed circuit board, a flexible flat cable manufacturing method, and a flexible printed circuit board manufacturing method capable of suppressing the occurrence of whiskers are provided. A flexible flat cable according to the present invention includes a conductor having a conductive base material made of copper or a copper alloy, and a conductive layer provided on the surface of the conductive base material. A first insulating layer 20 provided above and a second insulating layer 22 provided below the conductor 10, and the conductive layer 102 is a copper-tin intermetallic compound layer 61 formed on the conductive substrate 100. And a tin-bismuth solid solution formed on the copper-tin intermetallic compound layer 61 and composed of tin and bismuth, and a residual tin layer 62 containing at least tin and unavoidable impurities. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112951509-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112951509-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10973128-B2
priorityDate 2010-07-13^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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