| abstract |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of obtaining a cured product excellent in dimensional stability and obtaining an insulating layer excellent in low-temperature meltability, and an interlayer adhesive film for obtaining the insulating layer. SOLUTION: A polyimide resin having a biphenyl skeleton directly connected to a five-membered ring imide skeleton, a content of the biphenyl skeleton of 20 to 45% by mass, and a logarithmic viscosity of 0.2 to 0.8 dl / g. A thermosetting resin composition comprising (A), an epoxy resin (B), and an alkoxylated melamine resin (C), and applying the thermosetting resin composition onto a carrier film. An interlayer adhesive film for a printed wiring board obtained by drying. [Selection figure] None |