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publicationDate 2012-11-01^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012212917-A
titleOfInvention Semiconductor device
abstract Provided is a semiconductor device capable of improving reliability against external force, particularly pressing, while ensuring a circuit scale or a memory capacity. A pair of structures 101 and 102 in which a plurality of layers, in particular, three or more layers of fiber bodies 101a to 101c and 102a to 102c of an organic compound or an inorganic compound are impregnated with an organic resin 104, and a pair of structures are provided. And an element layer 103 provided between 101 and 102. The element layer 103 and the structures 101 and 102 can be fixed by thermocompression bonding. Alternatively, a layer for fixing the element layer 103 and the structures 101 and 102 may be provided. Alternatively, after a plurality of fibrous bodies 101a to 101c and 102a to 102c are stacked on the element layer 103, the fibrous bodies 101a to 101c and 102a to 102c are impregnated with the organic resin 104, whereby the structure body 101 fixed to the element layer 103 is obtained. 102 can be formed. [Selection] Figure 1
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