| abstract |
A substrate for a semiconductor device and a resin-encapsulated semiconductor device are sufficiently miniaturized in a planar direction. A substrate 10 for a semiconductor device includes a substrate 1, a plurality of external terminal portions 12pb, 12q that are arranged on the substrate 1 in a planar shape and have external terminal surfaces 12pb, 12qb facing the substrate 1, and a substrate. And a plurality of internal terminal portions 11 having an internal terminal surface 11a facing the opposite side with respect to the substrate 1. The internal terminal portion 11 and the external terminal portions 12p and 12q are connected by the wiring portion 17. Some of the external terminal portions 12p are arranged on the substrate 1 and in the arrangement planned area A where the semiconductor element 50 is arranged. External terminal portions 12q other than some external terminal portions 12p are arranged on the substrate 1 and outside the planned wiring area A. [Selection] Figure 2 |