http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012524990-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2010-04-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-10-18^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012524990-A |
| titleOfInvention | Manufacture of multilayer printed circuit boards |
| abstract | The present invention relates to a method for producing a multilayer printed circuit board and an article formed thereby, particularly an IC substrate. The method according to the present invention utilizes an inorganic silicate and organosilane bonding mixture in individual process steps to provide adhesion between the copper layer and the dielectric material. The method results in increased adhesion strength, improved mechanical and thermal stress resistance and moisture resistance of multilayer printed circuit boards and IC substrates. |
| priorityDate | 2009-04-24^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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