| abstract |
An object of the present invention is to provide a film device having excellent heat resistance, and to provide a layered product of a heat resistant resin layer and an inorganic material for producing the film device. A laminate comprising at least an inorganic layer and a resin film, and a film device manufacturing method using the laminate, (1) A step of treating the surface of at least one side of the inorganic layer with a coupling agent (2) At least one side of the inorganic layer treated with the coupling agent is subjected to a UV irradiation treatment according to a predetermined pattern. The process of providing the part from which the peeling strength between resin layers differs. (3) A step of drying and heat-treating a coating solution layer obtained by coating a resin solution or a resin precursor solution on the patterned inorganic layer-treated surface of the coupling agent, and forming the resin layer; The manufacturing method of the laminated body characterized by including the process of said (1)-(3). And after producing a device using this laminated body, creation of a film device is realized by peeling a portion having weak adhesive peel strength with respect to the substrate by a UV exposure process from the inorganic substrate according to a predetermined pattern. [Selection figure] None |