http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013030667-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ac8ea4f652c51209833279712f81831b
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-778
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-812
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-338
filingDate 2011-07-29^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47addd01267203c5b8b285907eb74da2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b12a67c603a7a229917b83a6324d67c
publicationDate 2013-02-07^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013030667-A
titleOfInvention Nitride semiconductor device and manufacturing method thereof
abstract A normally-off type nitride semiconductor device capable of suppressing an increase in on-resistance and further reducing a gate leakage current and a drain leakage current in an off state and a manufacturing method thereof. The upper nitride semiconductor layer 15 is made of a material larger than the lattice constant of the lower nitride semiconductor layer 14, and the upper nitride semiconductor layer surface 15 between the gate electrode, the source electrode and the drain electrode is replaced with nitrogen. Plasma treatment of gas is performed. By performing the plasma treatment, the two-dimensional electron gas layer 16 having a carrier concentration higher than the carrier concentration of the two-dimensional electron gas layer formed by the laminated structure of the nitride semiconductor layer without the plasma treatment is formed, and the characteristics are excellent. A normally-off type nitride semiconductor device is obtained. [Selection] Figure 1
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priorityDate 2011-07-29^^<http://www.w3.org/2001/XMLSchema#date>
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