| abstract |
An object of the present invention is to provide a polysiloxane compound useful for a curable resin composition capable of obtaining a cured product excellent in heat resistance and adhesiveness, and a moisture curable resin composition containing the same. A polysiloxane compound represented by the following general formula (1): (In the formula, R 1 to R 4 each independently represents an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 10 carbon atoms, and R 5 and R 6 each independently represent one having 1 to 4 carbon atoms. Represents an alkyl group, X 1 represents an alkyl group having 1 to 4 carbon atoms, an aryl group having 6 to 10 carbon atoms or an alkoxy group having 1 to 4 carbon atoms, and a is a compound represented by the general formula (1) Represents a number with a mass average molecular weight of 2000 to 1,000,000, and b represents 0 or 1.) [Selection figure] None |