http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013518445-A

Outgoing Links

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-2003
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-225
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-812
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-778
filingDate 2011-01-27^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-05-20^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013518445-A
titleOfInvention Normally-off gallium nitride based semiconductor devices
abstract The method includes forming (604) a relaxed layer (106, 506) in a semiconductor device (100, 500). The method also includes forming (606) a tensile layer (108, 510) on the relaxed layer, the tensile layer having a tensile stress. The method further includes forming a compression layer (110, 508) on the relaxed layer, the compression layer having a compressive stress. The compression layer has a piezoelectric polarization that is approximately equal to or greater than the spontaneous polarization of the relaxed, tensile, and compression layers. The piezoelectric polarization of the compression layer may be in the opposite direction to the spontaneous polarization of the compression layer. The relaxed layer may include gallium nitride, the tensile layer may include aluminum gallium nitride, and the compression layer may include aluminum indium gallium nitride. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017063172-A
priorityDate 2010-01-27^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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