| abstract |
The method of manufacturing a surface-mounted power LED support includes the steps of preparing a wiring board (1) having double-sided metal layers (11, 12), forming a hole (13), and a metal layer (131 on the surface of the hole). ), Thickening the metal layer (11, 12) of the wiring board, etching the metal layer of the wiring board, and cutting the wiring board to form a single support unit; including. The surface mount power LED support includes a double-sided wiring board (10, 11, 12), a hole (13) formed in the wiring board, and a wiring layer (16, 17) formed on the surface of the wiring board. The present invention can enhance the heat dissipation effect of the chip. |