| abstract |
To obtain a thermal flow meter capable of preventing water from adhering to a cut end portion of a lead exposed from a mold resin of a circuit package and corrosion. A thermal flow meter 300 according to the present invention is a circuit package in which a detection element 518 is mounted on leads 544 and 545 supported by a support frame 512, sealed with mold resin, and the support frame 512 is cut off. 400, and the support frame 512 is cut off to cover the cut ends 544a and 545a of the leads 544 and 545 exposed from the mold resin of the circuit package 400 with the cover 371. [Selection] Figure 5B |