http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014199254-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b9a255559e1d94f20510a17a673b1078 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J5-0225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J5-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01J1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01J1-06 |
| filingDate | 2014-03-10^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c76cb2a784bac33f414cd7688b00298b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f204ee781074d82fe216aa29a27f20d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7852ded52ee6adab1bab56d68398e5f3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30d3ec35ca5c177454dde13f56bd7499 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50e106bd68ac77daa8809ac5f0c5c85e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40c924129a32670fb888e039ef9f5cf4 |
| publicationDate | 2014-10-23^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014199254-A |
| titleOfInvention | Manufacturing method of backside illuminated infrared sensor and backside illuminated infrared sensor. |
| abstract | An object of the present invention is to provide an infrared sensor having a wide viewing angle without affecting circuit characteristics and without reducing the thickness of a substrate. A substrate in which a through-hole penetrating between an upper surface and a lower surface is formed; An infrared absorption part formed on the upper surface side of the substrate and separated from the substrate by the through hole; A temperature sensor unit for detecting a temperature change of the infrared absorbing unit, and a backside-illuminated infrared sensor having a temperature sensor unit, The through hole includes a first through hole component having an opening on the upper surface of the substrate and one or more other through hole components different from the first through hole component. Has been In the cross-sectional shape of the through-hole in a plane perpendicular to the upper surface of the substrate, the infrared rays in which the inner wall of the other through-hole constituent part is arranged outside the inner wall of the first through-hole constituent part Provide a sensor. [Selection] Figure 4 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11215510-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102016224977-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022158199-A1 |
| priorityDate | 2013-03-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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