| abstract |
A CSP type light emitting device capable of side view type mounting and capable of being manufactured at a wafer level and a method for manufacturing the same are provided. A method of manufacturing a light emitting device includes a step of preparing a wafer in which light emitting elements 1 are arranged on a growth substrate, and a p-side electrode 15 and an n-side electrode 13 are connected to one surface side of a semiconductor laminate 12. A step of forming the resin layer 31 having the metal wires 32p and 32n, and forming a groove 31a by removing a part or all of the thickness direction from the upper surface side of the resin layer 31 in the boundary region between the light emitting elements 1; A step of exposing the end faces 32pa, 32na of the metal wires 32p, 32n, which are internal wirings, to an inner side surface of the groove 31a; a step of forming an external connection electrode connected to the exposed end faces 32pa, 32na of the metal wires 32p, 32n; And dividing the wafer into a plurality of light emitting elements. [Selection] Figure 10 |