http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015160377-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
filingDate 2014-02-27^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bb5d9ed2665611d3d163d63c69f56d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a45a87d544d3993ba328b163ef939752
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a
publicationDate 2015-09-07^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015160377-A
titleOfInvention Metal-clad surface-treated fiber substrate and semiconductor device
abstract The present invention provides a metal-clad surface-treated fiber substrate that has a uniform and homogeneous insulating layer that does not cause opening and twisting of fibers when used as a substrate, and is excellent in heat resistance and dimensional stability. A substrate including one or a plurality of laminated surface-treated fiber films, wherein the value of the conventional bending rigidity of the surface-treated fiber film measured by the method described in JIS R 3420 is untreated. A metal-clad surface-treated fiber substrate having a metal film on one or both sides of the surface-treated fiber film or a laminate thereof, which is 3 to 100 times the conventional bending rigidity value of the fiber film. [Selection figure] None
priorityDate 2014-02-27^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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