abstract |
A semiconductor device capable of improving reliability and reducing on-resistance is provided. A semiconductor chip, a metal lead frame, a resin sealing portion, and a metal connector are provided. The semiconductor chip 1 has a surface electrode. The lead frame 2 includes a first portion 21 on which the semiconductor chip 1 is mounted and a second portion 22 that is provided apart from the first portion 21. The sealing part 4 is formed so as to cover the semiconductor chip 1. The connector 3 includes a first joint joined to the surface of the semiconductor chip 1, a flat plate-like second joint joined to the surface of the second portion 22 of the lead frame 2, and the first joint and the second joint. And a connecting portion 33 that connects the two portions. The second joint is joined perpendicularly to the second portion 22 of the lead frame 2. [Selection] Figure 1 |