http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015195412-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate | 2015-07-30^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32477aa4f5a41021f98fa0f681040e34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89c70af94230ee0ac3362e45f2104f3e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5768d521bfb58defc63b6e1d33a4055d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4b5c699995c1242063c1ab0d054fa23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd1cc523d37599da44a686253b10d237 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b680f574fc5b50e80c6623e225f898af http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b39abba3779887850eefd0c5e44d83c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_661fdfbaa0805792dd19c153fb6dd857 |
| publicationDate | 2015-11-05^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015195412-A |
| titleOfInvention | Lead frame for semiconductor element, lead frame for semiconductor element with resin and semiconductor device, method for manufacturing lead frame for semiconductor element, method for manufacturing lead frame for semiconductor element with resin, and method for manufacturing semiconductor device |
| abstract | A lead frame capable of suppressing the formation of foreign matter that impairs reliability is provided. A lead frame (10) includes a frame (13) including a front surface (13a), a back surface (13b), and an outer surface (13c), a die pad (25) on which a semiconductor element (21) is placed, A plurality of unit lead frames 14 having lead portions 26 spaced apart from the die pad 25 are provided. The outer surface 13c of the frame 13 has a front side region 15 and a back side region 16 extending in the peripheral direction, and the front side region 15 is provided with a plurality of front side recesses 17 along the peripheral direction. 16 is provided with a plurality of back surface side recesses 18 along the peripheral direction. Each front surface side concave portion 17 is formed from the outer surface 13c of the frame body 13 to the front surface 13a, and each rear surface side concave portion 18 is formed from the outer surface 13c of the frame body 13 to the rear surface 13b. [Selection] Figure 3 |
| priorityDate | 2015-07-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Showing number of triples: 1 to 28 of 28.