| abstract |
Provided is a copper foil with a carrier, which is excellent in laser drilling property of an ultrathin copper layer and suitable for manufacturing a high-density integrated circuit board. A carrier-attached copper foil having a carrier, an intermediate layer, and an ultrathin copper layer in this order, wherein the 60 ° specular gloss in the MD direction of the surface of the intermediate layer side of the ultrathin copper layer is 140 or less. Copper foil. [Selection] Figure 2 |