| abstract |
A semiconductor die, such as a light emitting element (LEE), is coated with a polymer binder, after which the polymer binder is cured to form a composite wafer of a solid binder and a die suspended therein. The composite wafer may be divided into independent “white dies”, each consisting of a die and a cured binder that at least partially surrounds the die. The binder may advantageously comprise a wavelength converting material such as a phosphor or a quantum dot assembly. Various mold substrates and / or molds may be utilized to secure the semiconductor die and / or to prevent coating of the die contacts during coating. |