| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0239
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02331
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C2029-5602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05669
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C2029-0403
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05673
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-119
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0558
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1438
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-56016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0392
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1437 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-50016 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2015-08-05^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1558d2df0afbf2f4ac86e38cd376041e |
| publicationDate |
2017-02-09^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017034185-A |
| titleOfInvention |
Semiconductor device manufacturing method and semiconductor device |
| abstract |
An object of the present invention is to prevent a connection failure between a connection member and a rewiring intended to be connected to the outside. A passivation film PSF and a polyimide film PIF1 are formed so as to cover a wiring layer MIT. An opening K1 is formed in the polyimide film PIF1 or the like. A rewiring REW is formed in the polyimide film PIF1 in such a manner that it is connected to the wiring layer MIT through the opening K1. A polyimide film PIF2 that covers the rewiring REW and has an opening K2 communicating with the rewiring REW is formed. A palladium film PDF is formed as a barrier film on the surface of the rewiring REW where the opening K2 is located by sputtering. A solder ball SLB is connected to the palladium film PDF. [Selection] Figure 18 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020027944-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102428328-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020047917-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190012307-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7225056-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7017992-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019029654-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7300939-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11626377-B2 |
| priorityDate |
2015-08-05^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |