http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017142260-A

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filingDate 2017-04-13^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95a25804c1a4c4be3c0979b4659c2610
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publicationDate 2017-08-17^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017142260-A
titleOfInvention Inspection system and method
abstract An inspection system based on TDI using a smaller TDI device while reducing difficulties in driving, processing, and illumination. An inspection system for inspecting a wafer / mask / reticle surface may include a modular array. The modular array may include a plurality of time delay integration (TDI) sensor modules 410. Multiple TDI sensor modules may be arranged to capture the same inspection area or different inspection areas. The plurality of TDI sensor modules may be the same or may be provided for different integration stages. The module interval can be set so as to correspond to the processing range covering 100% of the inspection area in one pass, or two or more passes are required to cover the entire processing range. It can also be set so as to correspond to a partial processing range. [Selection] Figure 4
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