http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019183171-A

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filingDate 2019-07-18^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57a6f2107c905007927988ae4f08a6fe
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publicationDate 2019-10-24^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019183171-A
titleOfInvention Void structure film bonded through catalytic action and method for producing the same
abstract PROBLEM TO BE SOLVED: To provide a void structure film having a porous structure with a high porosity while suppressing the occurrence of cracks and having strength. SOLUTION: The void structure film of the present invention is characterized in that one type or plural types of structural units forming a fine void structure are chemically bonded through catalytic action. For example, the void structure film of the present invention has a scratch resistance of 60 to 100% by Bencot (registered trademark) and a folding resistance of 100 or more by the MIT test. For example, the void structure film is formed by forming a precursor of the silicone porous body using a sol containing a pulverized product of a gel silicon compound, and chemically processing the pulverized products contained in the precursor of the silicone porous body. It can manufacture by combining with. The chemical bond between the pulverized products is preferably, for example, a chemical cross-linking bond between the pulverized products. [Selection figure] None
priorityDate 2014-12-26^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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