| abstract |
PROBLEM TO BE SOLVED: To cure even under a film forming condition in an inert gas, and not only have excellent heat resistance, embedding and flattening characteristics of a pattern formed on a substrate, but also have a small amount of sublimation and good film forming property on a substrate. Provided are a polymer capable of forming an organic film and a composition for forming an organic film containing the polymer. SOLUTION: The composition for forming an organic film contains a polymer having a partial structure represented by the following general formula (1) as a repeating unit and an organic solvent. [Chemical 1] (In the general formula (1), AR1 and AR2 are benzene rings or naphthalene rings which may have a substituent, W 1 is a specific partial structure having a triple bond, and two or more kinds of W 1 are used. May be used in combination, W 2 is a divalent organic group having at least one or more aromatic rings and 6 to 80 carbon atoms.) [Selection diagram] None |