http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2779573-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate | 1992-11-05^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1998-07-23^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1998-07-23^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2779573-B2 |
| titleOfInvention | High heat dissipation integrated circuit package |
| priorityDate | 1992-11-05^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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