| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y80-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-611 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate |
2004-09-22^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-06-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-06-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-4100385-B2 |
| titleOfInvention |
Multilayer structure forming method, wiring board manufacturing method, and electronic device manufacturing method |
| priorityDate |
2004-09-22^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |