| abstract |
[PROBLEMS] To provide a transfer substrate for forming a metal wiring on a transfer object by a transfer method, which can reduce the heating temperature on the transfer object side, and a method of forming a metal wiring. The present invention comprises a substrate, at least one metal wiring material formed on the substrate, and a base metal film formed between the substrate and the metal wiring material, and the metal wiring material. The metal wiring material is formed by sintering gold powder having a purity of 99.9% by weight or more and an average particle size of 0.01 μm to 1.0 μm. It is a molded body, and the base metal film is a transfer substrate made of a metal such as gold or an alloy. This transfer substrate can transfer the metal wiring material to the transfer object even if the heating temperature of the transfer object is 80 to 300 ° C. [Selection] Figure 1 |