| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0415
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3457 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate |
2006-09-05^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-11-20^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2013-11-20^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-5345848-B2 |
| titleOfInvention |
Method for controlling solder deposition on heat spreaders used in semiconductor packages |
| abstract |
Method for controlling the deposition of solder on a heat spreader or heat sink is disclosed. The method comprises applying an attaching flux and finishing flux to a heat spreader, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally insoluble corrosive residues that would occur when the attaching flux is subjected to reflow conditions with the preform and heat spreader. Alternatively, the attaching flux may be applied to the preform and heat spreader before undergoing reverse reflow conditions and then the finishing flux is applied to the solder deposit and heat spreader and the same subjected to second reflow conditions. After each method, the residues left from the attaching flux which are solubilized by the finishing flux, are cleaned by washing with a typical solvent. The solder deposit can be optionally flattened before coupling with a die. Further, an attach flux may also be applied on the solder deposit on the heat spreader to assist in the coupling to the die or heat sink. |
| priorityDate |
2005-09-06^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |