http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5470487-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0614 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10 |
| filingDate | 2013-06-10^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-04-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-04-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5470487-B1 |
| titleOfInvention | Copper foil, copper clad laminate for semiconductor package using the same, printed wiring board, printed circuit board, resin substrate, circuit forming method, semi-additive method, circuit forming substrate for semiconductor package, and semiconductor package |
| abstract | The present invention provides a copper foil for a semi-additive method in which the adhesion between an etching surface of a resin base material to which a copper foil surface profile has been transferred and a plating film is good when laminated on a resin base material and etched entirely. A copper foil comprising a copper foil bulk layer, a roughening treatment layer formed on the copper foil bulk layer, and a rust prevention treatment layer containing chromium formed on the roughening treatment layer. When the copper foil is laminated on the resin substrate from the surface side having the roughening treatment layer, and the copper foil is etched entirely using an etching solution, the etched surface of the resin substrate after the entire surface etching When the surface concentration of Cr, Zn, C, O, and Si is A, B, C, D, and E, respectively, the Cr content ratio (%) [= A / ( A + B + C + D + E) × 100] is 0.1 to 10% copper foil. [Selection] Figure 3 |
| priorityDate | 2013-05-29^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Showing number of triples: 1 to 88 of 88.